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The Definition of Multilayer PCB

 

Compared with double-sided PCB or a 2-layer PCB board, Multi-Layer or Multilayer Printed Circuit Boards (พีซีบี), or Multilayer Boards (MLBs) must have a minimum of 3 conductive layers of conductive material or copper layer. All the layers are interconnected with copper plated holes, including NC vias and laser micro-vias either in plated through, or in buried and blind.

 

The Benefit of Multilayer PCB

 

Multilayer PCB can support a high level of circuit complexity because they consist of three or more copper layers laminated together.

Compact Size: Multilayer PCB reduces the overall size of electronic devices by combining multiple board functions into a single compact board.

Increased Component Density: With internal conductive layers and interlayer vias, multilayer PCB allows more components per unit area, enabling complex circuits to be realized in limited space.

Higher Reliability: Stronger bonds between laminated layers in multilayer PCB provides better resistance to temperature fluctuations, vibration, humidity and mechanical stress.

Improved Electrical Performance: Multilayer PCB provide dedicated signal, power, and ground planes for enhanced noise isolation, controlled impedance routing, and reduced EMI.

Enhanced Heat Dissipation: The planar layers in multilayer PCB can be patterned to efficiently direct heat away from critical areas for improved heat dissipation.

Easy Assembly / Testing: Integrating several simpler boards into a single multilayer PCB simplifies the assembly and testing process.

Design Flexibility: multilayer PCB allows for easier last-minute modifications by rewiring in the inner layers, providing greater flexibility than single or double-layer boards.

 

The Capability Overview of Multilayer PCB

 

Item Mass Production Prototype
Layer Count (Max) 18 24
Board Material High Frequency, Normal & High Tg FR4, IMS High Frequency, Normal FR4, IMS, Hybrid Material
Max. Copper Thickness 6 OZ 9 OZ
Min. Core Dielectric Thickness 0.0635 มม 0.05 มม
Layer to Layer Registration Tolerance ±0.0635 mm ±0.05 mm
Finished Board Thickness 0.4-5.0 มม 0.35-5.0 มม
Drilled Hole Size-Mechanical 0.2-7.5 มม 0.2-8.0 มม
Min. Drilled Hole Size-Laser 0.075 มม 0.0635 มม
Min. Buried Hole 0.15 มม 0.15 มม
Press Fit Hole Tolerance ±0.045 mm ±0.04 mm
Plated Through Hole Tolerance ±0.0635 mm ±0.05 mm
Non-Plated Through Hole Tolerance ±0.038 mm ±0.025 mm
BGA Pitch (with trace) 0.45 มม 0.4 มม
Single-ended /Differential Impedance ±8% ±6%
Min. Space Edge to Conductor 0.175 มม 0.15 มม
Plating Aspect Ratio 12:1 14:1
Minimum Line Width/Space (Inner Layer) 1/2 oz Base Cu 2.8/ 2.8 mil 2.5 / 2.8 mil
1 oz Base Cu 3.2 / 3.8 mil 3.0 / 3.5 mil
2 oz Base Cu 5.2 / 5.6 mil 4.8 / 5.2 mil
3 oz Base Cu 6.5 / 8.0 mil 6.2 / 7.5 mil
4 oz Base Cu 8.6 / 10.2 mil 8.2 / 9.8 mil
5 oz Base Cu 10.0 / 11.5 mil 9.5 / 11.0 mil
Minimum Line Width/Space (Outer Layer) 1/3 oz Base Cu 2.8 / 3.0 mil 2.5 / 2.8 mil
1/2 oz Base Cu 3.2 / 3.6 mil 3.0 / 3.5 mil
1 oz Base Cu 5.2 / 5.6 mil 4.8 / 5.2 mil
2 oz Base Cu 7.0 / 7.5 mil 6.5 / 7.0 mil
3 oz Base Cu 9.0 / 10.5 mil 8.5 / 10.0 mil
4 oz Base Cu 11.0 / 12.5 mil 10.5 / 12.0 mil
Solder Mask Registration ±0.038 mm ±0.025 mm
Min. Solder Dam 0.0635 มม 0.06 มม
Controlled Depth Drilling Tolerance ±0.05 mm ±0.05 mm
Min. Delivery Panel Size 60×75 มม 60×60 มม
Max. Delivery Panel Size 520×600 มม 520×650 มม
Warpage Control 0.45% max 0.4% max
Plated Over Filled Vias(POFV) YES YES
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