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The Definition of Rigid Flex PCB

‌A rigid flex board is a circuit board that combines the characteristics of a flexible circuit board (‌FPC) and a rigid circuit board (‌PCB). It combines a flexible circuit board with a rigid circuit board according to relevant process requirements through processes such as pressing, thereby forming a circuit board with the characteristics of both FPC and PCB. This combination board not only inherits the bendability of a flexible circuit board and the rigidity of a rigid circuit board, but also has the advantages of saving internal space of the product and meeting the needs of development in the direction of high density, miniaturization, lightweight, thinness, and high reliability.

The Definition of Rigid Flex PCB

The Benefit of Rigid Flex PCB

Space Efficiency: Rigid Flex PCB are extremely space efficient because they eliminate the need for connectors and reduce the need for additional interconnections. They can be folded or bent to fit into tight spaces, making them ideal for compact and densely arranged electronic equipment.

Reliability: The fewer connectors there are, the fewer potential points of failure, which increases the reliability of the entire system. Rigid Flex PCB are less prone to connector-related problems.

Durability: Rigid Flex PCB can withstand mechanical stress, vibration and temperature changes, making them suitable for use in harsh environments.

Cost-Effective: Rigid Flex PCB help you minimize overall PCB size, replace board-to-board connectors, and reduce the number of assembly processes. This can lead to significant savings in logistics costs.

Complex Geometries: Rigid flex technology allows for the creation of complex board shapes and three-dimensional configurations that are difficult to achieve with traditional PCBs.

The Capability Overview of Rigid Flex PCB

Item	Mass Production	Prototype
Number of Layers	2-18 л	2-20 л
Max Board Size	480*800мм	480*800мм
Outline Dimensional Tolerance	±0.10mm (≤100mm) ±0.10%mm (＞100mm)	±0.10mm (≤100mm) ±0.10%mm (＞100mm)
Thickness Range	0.3-3.2мм	0.3-4мм
Thickness Tolerance (Thk≥0.8mm)	±8%	±8%
Thickness Tolerance (Thk<0.8мм)	±10%	±8%
Dielectric Thickness	0.03-5.00мм	0.03-5.5мм
Minimum Outer Line Width /Line Spacing	0.075/0.075мм (Finished copper≤1OZ)	0.075/0.075мм (Finished copper≤1OZ)
Min Inner Layer Line Width /Line Spacing	0.05mm/0.05mm (Base copper 12um)	0.05mm/0.05mm (Base copper 12um)
VIA PAD Min Annular Ring (Double sided)	≥0.05mm	≥0.05mm
Minimum Distance of Conductor from Outline or NPTH	≥0.15mm	≥0.15mm
Min Annular Ring (Four Layers and Above)	≥0.1mm	≥0.1mm
Outer Finished Copper	35-105um	35-140um
Inner Copper	12-70um	12-105um
Hole Size (Mechanical Drill)	0.10-6.35мм	0.10-6.5мм
Laser Drilling (Hole-filling Electroplating is Required)	0.075-0.1мм	0.05-0.15мм
Aperture Tolerance (mechanical drill)	PTH±0.075mm NPTH±0.05mm	PTH±0.05mm NPTH±0.04mm
Hole Position Tolerance (mechanical drill)	±0.05mm	±0.05mm
Minimum Distance from Inner Hole Edge to other Network Conductor	(4 Layers) 5мил, (6 Layers) 6мил, (8 Layers and above) 8мил	(4 Layers) 5мил, (6 Layers) 6мил, (8 Layers and above) 8мил
Alignment Deviation between Layers (Non-adjacent Layers)	±0.1mm	±0.1mm
Alignment Deviation between Layers (Adjacent Layers)	±0.05mm	±0.05mm
Aspect Ratio -Through Hole	12:1	13:1
Aspect Ratio-Blind Hole & Microvia	2:1	2:1
Solder Mask to Position Tolerance (Ink)	±0.05mm	±0.038mm
Min Soldermask Bridge	0.1мм	0.08мм
Minimum Distance of PAD without Ink	0.05мм	0.04мм
Minimum Distance between Ink and Circuit or Copper	0.05мм	0.04мм
Solder Mask or Silkscreen Color	White/Black/Yellow/Green/Red/Blue/Gray	White/Black/Yellow/Green/Red/Blue/Gray
Position Accuracy of Silkscreen	±0.3mm (semi-automatic)	±0.2mm (Spray silkscreen)
Minimum Line Width of Silkscreen	≥0.1mm (silkscreen, legend height≥0.8mm)	≥0.075mm (Spray silkscreen, legend height≥0.65mm)
Plug Hole Diameter	0.1-0.5мм ( Plug hole resin) 0.1-0.25мм (Plug hole ink)	0.1-0.6мм (Plug hole resin) 0.1-0.3мм (Plug hole ink)
Surface Treatment Type	HAL, ENIG, Imm tin, Imm AG, OSP, Planting Gold	HAL, ENIG, Imm tin, Imm AG, OSP, Planting Gold
Spacing from The Min Hole Edge to the Cover Opening Area	0.7мм	0.6мм
Minimum Open Cover Width	1.5мм	1.2мм
Minimum Distance between Circuit and Cover Opening Area	0.5мм	0.4мм
Countersunk hole can be machined for Angle and depth tolerances	Angle: 90°, 120°, 180° Depth Tolerances: +/-0.15мм	Angle: 90°, 120°, 180° Depth Tolerances: +/-0.13мм
Resistance Tolerance	Characteristic Resistance: ±10% Differential Resistance: ±10%	Characteristic Resistance: ±8% Differential Resistance:±8%