6층 1.6mm Rigid-Flex 회로 기판

층: 6 레이어

370HR

RF775

두께: 1.6mm

표면 마감: Vias fill with resin

The Six-layer 1.6mm Rigid-Flex circuit board is one of the series of Rigid Flex Boards developed and produced by Lian Jin Cheng Electronic Technology Limited. This product is made from 370HR，RF775 PCB substrates, Made using resin plugging and other processes. 그것은 산업에서 주로 사용됩니다, 가전제품, 자동차 및 기타 분야.