層: 6 レイヤー
370HR
RF775
厚さ: 1.6んん
表面仕上げ: Vias fill with resin
層: 6 レイヤー
370HR
RF775
厚さ: 1.6んん
表面仕上げ: Vias fill with resin
The Six-layer 1.6mm Rigid-Flex circuit board is one of the series of Rigid Flex Boards developed and produced by Lian Jin Cheng Electronic Technology Limited. This product is made from 370HR,RF775 PCB substrates, Made using resin plugging and other processes. 主に産業用に使用されます, 家電, 自動車およびその他の分野.