Capa: 6 capas
370HR
RF775
Thickness: 1.6milímetros
Acabado superficial: Vias fill with resin
Capa: 6 capas
370HR
RF775
Thickness: 1.6milímetros
Acabado superficial: Vias fill with resin
The Six-layer 1.6mm Rigid-Flex circuit board is one of the series of Rigid Flex Boards developed and produced by Lian Jin Cheng Electronic Technology Limited. This product is made from 370HR,RF775 PCB substrates, Made using resin plugging and other processes. Se utiliza principalmente en la industria, electrónica de consumo, automoción y otros campos.